| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for preventing generation of a defective product because of flowing of solder during the assembling work. <P>SOLUTION: Since a second principal surface of a firs end 7a of a frame 7 is formed so that it is accommodated within the internal side more than the front surface of an electrode 4, when the electrode 4 is connected by soldering with the first end 7a, the solder shows wet up-diffusion toward the side surface of the first end 7a from the external circumferential surface of the electrode 4 located at the external side of the first end 7a together with the self-alignment, for locating and keeping the first end 7a to the center of the electrode 4 with the surface tension and wet up-diffusion phenomenon. Consequently, a solder extension preventing means can be established. Accordingly, it can be prevented that the solder leaks to the external side of the electrode 4 and is adhered to the front surface or side surface of a semiconductor chip 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
