| 摘要 |
PROBLEM TO BE SOLVED: To prevent interruption and overflow of an adhesive for mounting a delivering elements onto a mount substrate. SOLUTION: V-shape grooves 13 and 14 are provided in a mount region which surrounds ink supply ports 11 and 12 of the mount substrate 10 to which the delivering elements 1 and 2 are bonded and fixed. The adhesive applied by a transfer pin is held in the V-shape grooves 13 and 14, whereby stable application of the adhesive is enabled. At the same time, spreading of the adhesive by chip mounting is prevented. After the delivering elements 1 and 2 are mounted, an electric wiring plate 30 is joined via an auxiliary plate 20, and the periphery of the delivering elements 1 and 2 is sealed by sealants 41 and 42. COPYRIGHT: (C)2006,JPO&NCIPI
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