发明名称 Wiring board
摘要 An intermediate board (200) has a board core composed of a core main body (100m) and a sub-core portion (1). The core main body (100m) is formed into a plate shape by a macromolecular material, and is formed with a sub-core housing portion (100h) which is opened and formed on a first main surface by reducing its thickness. The sub-core portion (1) is formed into a plate shape by ceramic, and is housed in the sub-core housing portion (100h) so that its thicknesswise direction matches with that of the core main body (100m). A first terminal array (5) of the board core (100) is formed in a position where it overlaps the sub-core portion (1) in orthographic projection to a reference surface parallel with a plate surface of the board core (100) . The sub-core portion (1) incorporates a laminated ceramic capacitor where a first electrode conductor layer (54), a ceramic layer (52) and a second electrode conductor layer (57) are laminated periodically in this order. The first electrode conductor layer is conductive with a first side first type terminal (5a) and a second side first type terminal (7a). The ceramic layer is composed of a dielectric layer. The second electrode conductor layer is conductive with a first side second type terminal (5b) and a second side second type terminal (7b). In the sub-core housing portion (100h), an inner edge of the cross section along a plane parallel with a plate surface of the sub-core portion (1) has a quadrate shape, and a radius portion with dimension of not less than 0.1 mm to not more than 2 mm is formed on its corners.
申请公布号 EP1691590(A2) 申请公布日期 2006.08.16
申请号 EP20060002669 申请日期 2006.02.09
申请人 NGK SPARK PLUG CO., LTD. 发明人 MURAMATSU, MASAKI;YURI, SHINJI;URASHIMA, KAZUHIRO;YAMAMOTO, HIROSHI;SEKI, TOSHITAKE;SATO, MOTOHIKO
分类号 H05K1/18;H01G4/224 主分类号 H05K1/18
代理机构 代理人
主权项
地址