| 摘要 |
Methods for the production of a board ( 11 ) with printed circuit ( 12 ) shielded against interfering radiation and having electronic components ( 14 ) comprise the steps of positioning of the electronic components ( 14 ) on contact points ( 15 ) designed for them, and the application of a shield ( 20 ), comprising a preformed metallized plastic film ( 30 ) over the top of the electronic components ( 14 ) and in electrical contact with the earth ( 13 ) on the board ( 11 ) with printed circuit ( 12 ), and also fixing the electronic components ( 14 ) on the board ( 11 ) with printed circuit ( 12 ) by means of an electrically conducting fixing agent ( 16 ); and fixing of the shield ( 20 ) on the board ( 11 ) with printed circuit ( 12 ).
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