发明名称 |
Method of making a center bond flip chip semiconductor carrier |
摘要 |
A center bond flip chip device carrier and a method for making and using it are described. The carrier includes a flexible substrate supporting a plurality of conductive traces. A cut out portion is formed in each trace at a position within a gap of a layer of elastomeric material provided over the traces. Each cut out portion is sized and configured to receive a solder ball for electrically connecting the carrier with a semiconductor die.
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申请公布号 |
US7091065(B2) |
申请公布日期 |
2006.08.15 |
申请号 |
US20030667391 |
申请日期 |
2003.09.23 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
JIANG TONGBI;WOOD ALAN G. |
分类号 |
H01L21/50;H01L21/60;H01L23/498;H05K1/02;H05K1/11;H05K3/28;H05K3/34 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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