发明名称 Methods of forming integrated circuit devices having a capacitor with a hydrogen barrier spacer on a sidewall thereof and integrated circuit devices formed thereby
摘要 An integrated circuit device is formed by providing a substrate and forming a capacitor on the substrate. The capacitor includes a lower electrode disposed on the substrate, a dielectric layer on the lower electrode, and an upper electrode on the dielectric. A hydrogen barrier insulation layer is formed on the upper electrode and a hydrogen barrier spacer is formed on a sidewall of the capacitor.
申请公布号 US7091102(B2) 申请公布日期 2006.08.15
申请号 US20030742727 申请日期 2003.12.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LIM HAN-JIN;LEE KWANG-HEE;CHUNG SUK-JIN;YOO CHA-YOUNG;KIM WAN-DON;LEE JIN-IL
分类号 H01L21/20;H01L21/02;H01L21/314;H01L21/8242;H01L21/8246;H01L27/108 主分类号 H01L21/20
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