| 摘要 |
The invention relates to a micromechanical resonator having a bondable resonance body and a method for fabricating a micromechanical resonator for semiconductor components. The invention provides that the resonator ( 26 ) is composed successively of a first layer ( 16 ) of silicon for coupling the resonator ( 26 ) in terms of a circuit, an insulating layer ( 14 ) of silicon dioxide, a cylindrical base layer (cylinder 18 ), and a metal layer ( 20 ) completely surrounding the cylinder ( 18 ). The method provides that a cylindrical structure ( 18 ) (cylinder) is etched (trench etching process) in a base layer ( 12 ) of p<SUP>-</SUP>-doped silicon (SOI wafer) separated from a layer ( 16 ) of silicon by an insulating layer ( 14 ), and the cylindrical structure ( 18 ) is coated with a metal layer ( 20 ).
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