发明名称 Signal transmission structure
摘要 A signal transmission structure is disclosed. The signal transmission structure is adapted for a circuit substrate, including at least a signal line, a plating bar and a reference plane. The plating bar is disposed on a side of the reference plane and connected to the signal line. In addition, the plating bar is disposed on the side of the reference plane, and the reference plane has a non-reference area corresponding to the plating bar. The signal transmission structure can reduce the impedance mismatch at the conjunction of the signal line and the plating bar, and the resonant frequency of the plating bar can be improved as to generate a desired transmission quality of the signal.
申请公布号 US7091803(B2) 申请公布日期 2006.08.15
申请号 US20040942611 申请日期 2004.09.15
申请人 VIA TECHNOLOGIES, INC. 发明人 LEE SHENG-YUAN
分类号 H01P3/08;H01P1/04;H05K1/02;H05K3/24 主分类号 H01P3/08
代理机构 代理人
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