发明名称 |
Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers |
摘要 |
A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central conductive track and an external conductive track separated by a dielectric material and is positioned in a core of the electronic device carrier or in the full thickness of the electronic device. The coaxial via structure can be combined with a stacked via structure so as allow efficient transmission of high speed signals across the electronic device carrier when a manufacturing process limits the creation of a full coaxial via structure across the entire electronic device carrier.
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申请公布号 |
US7091424(B2) |
申请公布日期 |
2006.08.15 |
申请号 |
US20030613553 |
申请日期 |
2003.07.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
OGGIONI STEFANO S.;ROGIANI GIANLUCA;SPREAFICO MAURO;VIERO GIORGIO |
分类号 |
H01R12/04;H01P1/04;H01P3/06;H05K1/02;H05K1/11;H05K3/42;H05K3/46 |
主分类号 |
H01R12/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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