| 摘要 |
An aqueous liquid composition comprising water; at least one acid selected from the group consisting of carboxylic acids, hydroxycarboxylic acids, and inorganic acids other than phosphoric acid wherein the at least one acid is present in an amount from about 1.0 to about 30 milliequivalents per kilogram of total composition ("mEq/kg"); and an amphoteric surfactant wherein the amphoteric surfactant is present in an amount from about 0.01 to about 20 grams per kilogram of total composition ("g/kg"), the aqueous liquid composition having a pH from about 2.0 to about 6.1 and having a reduced etch attack on metal as compared to an aqueous composition comprising from about 1.0 to about 30 milliequivalents per kilogram of total composition ("mEq/kg") of acids selected from the group consisting of carboxylic, hydroxycarboxylic, and inorganic acids, and not containing the amphoteric surfactant.
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