| 摘要 |
PROBLEM TO BE SOLVED: To form a metallic film of a specific pattern with a fewer processes without a mask by a resist film. SOLUTION: The method for manufacturing the metal structure having the metallic film on a substrate includes a process of forming a portion to form the metallic film by a conductor having a rugged shape, and a process of forming the metallic film preferentially in the portion having the rugged shape of the conductor by electroplating. A compound, like a cyanine die, which suppresses a plating reaction and loses a plating reaction suppressing effect simultaneously with progression of the plating reaction is preferably added into the plating solution. The metallic film can be preferentially formed in the portion having the rugged shape. COPYRIGHT: (C)2006,JPO&NCIPI
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