发明名称 METHOD OF FORMING FILM PATTERN, FILM PATTERN, RESIST FILM, INSULATION FILM, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, SURFACE ACOUSTIC WAVE DEVICE, SURFACE ACOUSTIC WAVE GENERATOR, ELECTRO-OPTICAL DEVICE AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a film pattern which enables forming a film pattern of desired pattern geometry while controlling flowing out of a liquid material from a film pattern formation area or spreading of the liquid material out of the film pattern formation area and realizes formation of a film pattern, a resist film and an insulation film and manufacture of a circuit board, a semiconductor device, a surface acoustic wave device, a surface acoustic wave generator, an electro-optical device and electronic equipment. SOLUTION: The method comprises discharging droplets 4 of a liquid material to reach the surface of a substrate 1 so as to be arranged in the periphery of an area 2 where a resist film 9 is to be formed, filling the area surrounded by the solidified peripheral band film 7a with the liquid material, solidifying the filling liquid material to form a central film 8 and forming a resist film 9 with the peripheral band film 7a and the central film 8. An insulation film is formed in a similar way. A circuit board, a semiconductor device and a surface acoustic wave device having such a film, an electro-optical device having the semiconductor device and electronic equipment having the electro-optical device, the circuit board and a surface acoustic wave generator are also provided. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006204991(A) 申请公布日期 2006.08.10
申请号 JP20050017927 申请日期 2005.01.26
申请人 SEIKO EPSON CORP 发明人 TOYODA NAOYUKI
分类号 B05D1/26;B05C5/00;B05C9/12;B05C9/14;B05D3/04;B05D7/24 主分类号 B05D1/26
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