发明名称 Minimized wire bonds in transient blocking unit packaging
摘要 A transient blocking unit (TBU) module which includes a control circuit, for detecting overcurrents, packaged together with integrated over-current protection and discrete over-voltage protection integrated into a single package. In one example embodiment, the present innovations are embodied as a unit for protecting a circuit from high voltage and high current, comprising a transient blocking unit component with at least one high voltage device wherein the transient blocking unit is integrated with the high voltage device.
申请公布号 US2006176638(A1) 申请公布日期 2006.08.10
申请号 US20050249165 申请日期 2005.10.12
申请人 FULTEC SEMICONDUCTORS, INC. 发明人 COATES STEPHEN
分类号 H02H9/06 主分类号 H02H9/06
代理机构 代理人
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