| 摘要 |
The temperature of a remote portion of device having a microelectromechanical oscillator is modulated to create oscillation of the oscillators. In one embodiment, a localized heat source is placed on a device layer of a multilayered stack, consisting of device, sacrificial and substrate layers. The localized heat source may be a laser beam in one embodiment. The oscillator is supported by the device layer and may be formed in the device layer in various embodiments. The oscillator may be spaced apart from the localized heat source.
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