Inline memory module architecture, has two arrays of memory devices located on respective sides of printed circuit board, where devices of one array are arranged to overlap relative to reference axis of circuit board

摘要

The architecture has two arrays of memory devices located on respective sides of a printed circuit board (PCB) (419), where the devices of an array are arranged to overlap relative to a reference axis of the PCB. Vias are formed on the PCB, where the vias are parts of a path that connects input and output terminals of the devices. The vias are located relative to the axis inward from signal pads of the devices of the arrays.