发明名称 Superabrasive wire saw for cutting ultra thin ceramic wafers
摘要 <p>A wire saw in which the blade is a metal wire having superabrasive grains bonded to the wire by metal braze or solder. An independent claim is also included for a process for making a wire saw in which a wire is coated with metal braze or solder and heated to bond the abrasive to the wire.</p>
申请公布号 DE29924903(U1) 申请公布日期 2006.08.10
申请号 DE1999224903U 申请日期 1999.03.02
申请人 SAINT-GOBAIN ABRASIVES, INC. 发明人
分类号 B23D61/18 主分类号 B23D61/18
代理机构 代理人
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