发明名称 |
Superabrasive wire saw for cutting ultra thin ceramic wafers |
摘要 |
<p>A wire saw in which the blade is a metal wire having superabrasive grains bonded to the wire by metal braze or solder. An independent claim is also included for a process for making a wire saw in which a wire is coated with metal braze or solder and heated to bond the abrasive to the wire.</p> |
申请公布号 |
DE29924903(U1) |
申请公布日期 |
2006.08.10 |
申请号 |
DE1999224903U |
申请日期 |
1999.03.02 |
申请人 |
SAINT-GOBAIN ABRASIVES, INC. |
发明人 |
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分类号 |
B23D61/18 |
主分类号 |
B23D61/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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