FILM DEPOSITION METHOD, STRUCTURE AND PIEZOELECTRIC ELEMENT MANUFACTURED USING THE SAME, AND LIQUID DISCHARGE HEAD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a film deposition method that uses an AD method to enable a film to be deposited at a relatively high temperature and the formation of a high precision pattern.

SOLUTION: The method of using an aerosol deposition method to deposit a film having a desired pattern comprises a step (a) of forming a first film containing a constituent having an amorphous structure on a target object; a step (b) of crystallizing the constituent having the amorphous structure contained in the first film in an desired film deposition region where a second film is deposited; and a step (c) of depositing the second film on the first film deposition region which is crystallized in the step (b) by injecting powder of film deposition material from a nozzle towards the first film.

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