| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit device including external electrodes with high connection reliability against a thermal stress. SOLUTION: The circuit device 10A is provided with circuit elements 12, pads 23A electrically connected to the circuit elements and each exposed from each exposed part 18, and cover resins 16 each covering each pad 23A on the rear side of the device. Further, each of projected parts 23C integrally and externally extended from each pad 23A is covered by each cover resin 16. Moreover, the width between the end of each exposed part 18 and each pad 23A at each of the projected part 23C is formed narrower than that of the other parts. Consequently, since the area of each projected part 23C exposed from each exposed part 18 is limited, the amount of solder soldered to each projected part 23C is limited when each external electrode 15 made of solder is attached to each pad 23A. Thus, the circuit device 10A including each bumped-up external electrode 15 can be provided. COPYRIGHT: (C)2006,JPO&NCIPI |
