| 摘要 |
PROBLEM TO BE SOLVED: To enhance the reliability of package of semiconductor device in electronic equipment. SOLUTION: The electronic equipment comprises an oblong mounting substrate provided with a first surface and a second surface of reverse face; an oblong tab, exposing its surface under the package and external electrode terminals; and a semiconductor device, fixed on the tab in the package and its electrodes are connected with the electrod terminals electrically; and the external electrode terminals and the tab of the semiconductor device are connected with certain circuits of the mounting substrate of the first surface via a bonding. The longitudinal direction of the oblong tab of the semiconductor device coincides with the longitudinal direction of the mounted substrate. The external electrode terminals of the semiconductor device are arrayed on both the side of the package, while holding the oblong tag inbetween them; the electronic equipment is a monitoring device of the lithium ion secondary battery; and the semiconductor device is a monitoring IC provided with charging terminals, input terminals, mode terminals, the first power terminals, and the second power terminals. COPYRIGHT: (C)2006,JPO&NCIPI |
