| 摘要 |
<p>Disclosed is a composition for optical semiconductor encapsulation containing a polyorganosiloxane (A), 100-1000 parts by weight of an aliphatic or alicyclic epoxy compound (B) per 100 parts by weight of the polyorganosiloxane (A), and a carboxylic acid anhydride curing agent (C). The composition may further contain a curing accelerator (D). The composition for optical semiconductor encapsulation is useful as a main component for optical semiconductor sealing materials which can be used for potting and enables to form an optical semiconductor sealing material which is excellent in transparency, UV resistance, heat resistance, and crack resistance to solder reflow and heat cycle.</p> |
