CERAMIC WIRING BOARD AND PROCESS FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

A ceramic wiring board (10) comprises a ceramic board (11) and a wiring layer (12) provided on the ceramic board (11). The wiring layer (12) comprises a wiring part (13) and a connection part (14). The wiring part (13) comprises a wiring part (13) comprising a substrate metal layer (15), a first diffusion preventive layer (16) and a first Au layer (17) stacked in that order on a surface of the ceramic board (11). The connection part (14) comprises a second diffusion preventive layer (19), a void-suppression layer (20), and a solder layer (18) stacked in that order at a desired position on the wiring part (13). The void-suppression layer (20) is formed of, for example, Au or an Au-Sn alloy containing not less than 85% by mass of Au.