发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce the leakage current via a high dielectric film. <P>SOLUTION: The semiconductor device comprises a single crystal silicon region 6, a polycrystalline or amorphous semiconductor film 7 which is formed on the silicon region 6 and contains at least one element among silicon and germanium, the high dielectric film 8 formed on the semiconductor film 7, and an electrode 12 formed on the high dielectric film 8. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006210512(A) 申请公布日期 2006.08.10
申请号 JP20050018415 申请日期 2005.01.26
申请人 TOSHIBA CORP 发明人 KAI TETSUYA
分类号 H01L27/108;H01L21/336;H01L21/8242;H01L29/78;H01L29/786 主分类号 H01L27/108
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