| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder joint method and device thereof which enable sure solder welding by ensuring solder wetness without using solder flux. <P>SOLUTION: The solder joint method includes a solder ball deforming process of deforming a solder ball mechanically to break an oxide film on the surface of the solder ball to expose non-oxidized surface, and a solder melting process of exposing the deformed solder ball mounted on solder joints of a work carried in to energy emission heating to melt the solder ball. In the solder ball deforming process, the solder ball is deformed mechanically, so that the solder ball forms at least two contact surfaces that come in close contact with the joint surfaces of the solder joints and are perpendicular to each other. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
