MODULE WITH BUILT-IN COMPONENT, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a module with a built-component of high connection reliability of inner via.

SOLUTION: A module with a built-in component 100 comprises an electric insulation layer 4 of a mixture containing inorganic filler and thermo-setting resin, and a pair of wiring boards 5 and 6 covering upper and lower surfaces of the electric insulation layer 4 respectively. A circuit component 3 embedded in the electric insulation layer 4 is jointed to at least one of the pair of wiring boards 5 and 6, and an inner via 2 solidified at the lower temperature than the thermo-setting resin of the electric insulation layer 4 electrically connects both wiring boards 5 and 6 together, which is provided to the electric insulation layer 4. A dummy via 1 which is solidified at the lower temperature than the thermo-setting resin of the electric insulation layer 4 is provided to the inner via 2 on the side opposite to the circuit component 3.

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