| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To increase interlayer adhesive strength, and hence to prevent problems of separation, or the like in reflow treatment, or the like, in a wiring board having a structure in which a ceramic dielectric layer and a polymer material dielectric layer are laminated compositely. <P>SOLUTION: The wiring board 1 has a wiring laminated part 6 where a dielectric layer and a conductive layer are laminated at least on one major surface of a board core part 2. The wiring laminated part 6 includes the composite laminated portion 6, where a polymer material dielectric layer 3A, a conductive layer 4B, and a ceramic dielectric layer 5 are laminated, in this order starting from the board core part 2 side in contact with one another. The conductive layer 4B of the composite laminated portion 6 has a conductor-side cutout 18, formed by cutting a part of the conductive layer 4B in a direction parallel to the conductive layer 4B , and the ceramic dielectric layer 5 has a ceramic-side cutout 16, formed by cutting a part of the ceramic dielectric layer 5 in a direction parallel to the ceramic dielectric layer 5, thus forming a communication cutout 21, where the ceramic-side cutout 16 and the conductive-side cutout 18 communicate with each other. The polymer material, forming the polymer material dielectric layer 3A, is placed in the communication cut 21, in such a way that it extends via the conductor-side cutout 18 to the ceramic-side cutout 16. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
