发明名称 PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board and its manufacturing method capable of sufficiently exerting the convenience of a proper screen-printing method along with easily and simply designing an optional passive element, by eliminating the requirement of checking experimentally each individual passive element. SOLUTION: The wiring board is provided with a substrate 1, a wiring layer 2 arranged on the substrate 1, electrodes 3 and 4 connected with the wiring layer 2, and passive elements consisting of a functional film 6 printed by a screen printing method and formed. While having the two or more passive elements, the areas of each functional film 6 of the plurality of the passive elements are mutually made to the same area, and moreover, the plurality of passive elements are connected in series or in parallel. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006210664(A) 申请公布日期 2006.08.10
申请号 JP20050021049 申请日期 2005.01.28
申请人 TOPPAN PRINTING CO LTD 发明人 ENDO MITSUTERU;KAWAMOTO KENJI
分类号 H05K1/16 主分类号 H05K1/16
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