| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor that provides a semiconductor device excellent in moisture resistance reliability and high-temperature storability. SOLUTION: The epoxy resin composition for sealing a semiconductor comprises as essential ingredients (A) an epoxy resin, (B) a phenolic resin, (C) a cure accelerator, (D) an inorganic filler and (E) active alumina, where the content of the active alumina (E) is at least 0.01 wt% and at most 5 wt% based on the whole epoxy resin composition. Preferably, the active alumina (E) is porous alumina having an average specific surface area of at least 30 m<SP>2</SP>/g and at most 400 m<SP>2</SP>/g. COPYRIGHT: (C)2006,JPO&NCIPI
|
