发明名称 METHOD FOR ELECTRICAL INTERCONNECTION BETWEEN PRINTED WIRING BOARD LAYERS USING THROUGH HOLES WITH SOLID CORE CONDUCTIVE MATERIAL
摘要 The present invention provides a printed wiring board and a method of manufacture therefor. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.
申请公布号 US2006175081(A1) 申请公布日期 2006.08.10
申请号 US20060379256 申请日期 2006.04.19
申请人 AGERE SYSTEMS INC. 发明人 COHN CHARLES;KLEMOVAGE JEFFREY M.
分类号 H05K1/00;H05K3/10;H05K3/40 主分类号 H05K1/00
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