发明名称 |
METHOD FOR ELECTRICAL INTERCONNECTION BETWEEN PRINTED WIRING BOARD LAYERS USING THROUGH HOLES WITH SOLID CORE CONDUCTIVE MATERIAL |
摘要 |
The present invention provides a printed wiring board and a method of manufacture therefor. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.
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申请公布号 |
US2006175081(A1) |
申请公布日期 |
2006.08.10 |
申请号 |
US20060379256 |
申请日期 |
2006.04.19 |
申请人 |
AGERE SYSTEMS INC. |
发明人 |
COHN CHARLES;KLEMOVAGE JEFFREY M. |
分类号 |
H05K1/00;H05K3/10;H05K3/40 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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