AN ELECTRONIC DEVICE, A CHIP CONTAINING METHOD AND A CONTACTING DEVICE

摘要

An electronic device comprises a chip (10) and a carrier substrate (16), wherein the carrier substrate (16) comprises a conductive structure (18) and the chip (10) comprises a pair of bonding pads (13) on a side facing the carrier substrate (16). The bonding pads (13) are in electrical contact with the conductive structure (18). The chip (10) further comprises a non­conductive space layer (14) on the side facing the carrier substrate (16), wherein the non-conductive space layer (14) defines the distance between the chip (10) and the conductive structure (16) of the carrier substrate (16).