发明名称 CONNECTION COMPONENT, MULTILAYER SUBSTRATE
摘要 <p>A connection component ensuring reliable connection. In a connection component (1), a first connection terminal (13a) is arranged on one side of a supporting member (11) composed of an elastic body, and a second connection terminal (13b) is arranged on the back. The connection terminals (13a, 13b) are interconnected through conductive films (12a, 12b, 12c) which are formed on the surface of the supporting member (11). The connection component (1) is arranged between circuit boards mounted with electronic components and the circuit boards are secured to each other under a state where the connection component (1) is compressed. The first and second connection terminals (13a, 13b) are pressed against lands on the circuit boards by restoration force of the connection component (1) and the circuit boards are electrically connected with each other.</p>
申请公布号 WO2006082745(A1) 申请公布日期 2006.08.10
申请号 WO2006JP301203 申请日期 2006.01.26
申请人 SONY CHEMICALS CORP.;SUZUKI, KAZUAKI;TANIGUCHI, MASAKI 发明人 SUZUKI, KAZUAKI;TANIGUCHI, MASAKI
分类号 H01R12/71;H05K1/14;H01R11/01 主分类号 H01R12/71
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