发明名称 |
CONNECTION COMPONENT, MULTILAYER SUBSTRATE |
摘要 |
<p>A connection component ensuring reliable connection. In a connection component (1), a first connection terminal (13a) is arranged on one side of a supporting member (11) composed of an elastic body, and a second connection terminal (13b) is arranged on the back. The connection terminals (13a, 13b) are interconnected through conductive films (12a, 12b, 12c) which are formed on the surface of the supporting member (11). The connection component (1) is arranged between circuit boards mounted with electronic components and the circuit boards are secured to each other under a state where the connection component (1) is compressed. The first and second connection terminals (13a, 13b) are pressed against lands on the circuit boards by restoration force of the connection component (1) and the circuit boards are electrically connected with each other.</p> |
申请公布号 |
WO2006082745(A1) |
申请公布日期 |
2006.08.10 |
申请号 |
WO2006JP301203 |
申请日期 |
2006.01.26 |
申请人 |
SONY CHEMICALS CORP.;SUZUKI, KAZUAKI;TANIGUCHI, MASAKI |
发明人 |
SUZUKI, KAZUAKI;TANIGUCHI, MASAKI |
分类号 |
H01R12/71;H05K1/14;H01R11/01 |
主分类号 |
H01R12/71 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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