| 摘要 |
<p>[PROBLEMS] To provide a multilayer printed wiring board which does not deteriorate connection reliability by forming a filled via directly above a small-diameter filled via. [MEANS FOR SOLVING PROBLEMS] A stress applied on the filled via (60) formed on covering plating layers (36a, 36d) is larger than that applied on a filled via (160) formed on a second interlayer resin insulating layer (150) during a heat cycle. Thus, a bottom diameter (d1) of the filled via (60) is made larger than a bottom diameter (d2) of the filled via (160) formed directly above.</p> |
