| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated lead frame wherein a wire bonding section provided at the tip of a lead can sufficiently be ensured and the wire bonding section is made smooth to improve joint strength with a bonding wire, and to provide its manufacturing method. SOLUTION: A plurality of thin boards 11 and 12 worked to a specified shape are stuck, and a plurality of leads directing to a central semiconductor arrangement area are provided with thinned wire bonding sections 19 on their tips. In the laminated lead frame such a structure and its manufacturing method, a recessed groove 20a is formed on a boundary between an area 20 as the wire bonding section 19 and a lead 18 on its base side which are formed in the lowermost thin plate 11, and then the area 20 is planarized by pressing working. COPYRIGHT: (C)2006,JPO&NCIPI |
