发明名称 HEAT DISSIPATION STRUCTURE OF HEATING ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a heat dissipation structure which performs the thermal bonding of a heating element, such as an electronic apparatus, etc. easily, and which can be held in the inside of a housing in the housing in which many components of the engine room, etc. of an automobile are arranged. SOLUTION: In the inside of the housing, the heating element is pushed to the housing inside, and the heating element joins thermally and is held. In the heat dissipation structure of the heating element, an operation for performing the pushing of the heating element to the housing inside is performed from the direction substantially orthogonal to the normal of the inner surface of the housing. In the heat dissipation structure of the heating element 1, the housing 3 inside which the heating element 1 is pushed, and it joins thermally is the inner surface 3b of the housing side wall 3a, and the operation for performing the pushing of the heating element 1 is carried out from the housing 3 upper part direction. The heat dissipation structure of the heating element where a heat sink 9 is formed in the outer surface 3c of the housing 3 in the inside of the back of the housing 3 in which the pushing of the heating element 1 is performed, and it joins thermally. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006210470(A) 申请公布日期 2006.08.10
申请号 JP20050017816 申请日期 2005.01.26
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 KOYATA KEN
分类号 H05K7/20;H01L23/40 主分类号 H05K7/20
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