| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing an electronic part having the flat top face of a ceramic frame body, being capable of firmly mounting a cover body without an opening and having an excellent reliability on an airtight sealing and an electronic device. SOLUTION: In the package 9 for housing the electronic part, a ceramic frame body 2 is mounted so as to surround a loading section 1a on the top face of a ceramic base body 1 with the loading section 1a for loading the electronic part 4, while the cover body 3 covering the electronic part 4 is fitted on the ceramic frame body 2. In the package 9 for housing the electronic part, the ceramic frame body 2 is formed of the laminates 6 of a plurality of ceramic layers 5 while low shrinkage layers 7 having a smaller shrinkage factor with a baking than ceramic green sheets as the ceramic layers 5 are interposed among the interlayers and/or the laminates 6 of the ceramic layers 5 and the ceramic base body 1. COPYRIGHT: (C)2006,JPO&NCIPI
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