| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiple wiring board reduced in the possibility of any crack or the like occurring at the time of dividing. SOLUTION: The multiple wiring board 9 is so configured that a dividing groove 3 is formed along a boundary between adjacent wiring board regions 2 on at least one principal surface of a ceramic mother board 1 where a plurality of the substantially rectangular wiring board regions 2 are disposed like a matrix. The ceramic mother board 1 has a through-hole 5 between contiguous corners of the adjacent wiring board regions 2 in a row/column direction. The inner surface of the through-hole 5 along each corner of the wiring board region 2 is formed into a protruded curved surface shape or into a flat surface shape, such that a chamfered part is provided at four corners of each wiring board region 2 when the ceramic mother board 1 is viewed in a flat plane. COPYRIGHT: (C)2006,JPO&NCIPI
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