发明名称 SEMICONDUCTOR APPARATUS AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To efficiently apply a tensile stress to a channel area in a p-chennel MOS transistor formed on a strained SOI substrate. SOLUTION: When a p-channel MOS transistor is formed on a strained Si channel layer having a non-strained SiGe mixed crystal layer in its lower layer, the non-strained SiGe mixed crystal layer is epitaxially grown to an SiGe mixed crystal area, and the strained Si channel layer is lattice-matched with the SiGe mixed crystal layer area. Thus, the stress in the strained Si channel layer is prevented from being released, and efficient application of stress is achieved. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006210596(A) 申请公布日期 2006.08.10
申请号 JP20050019855 申请日期 2005.01.27
申请人 FUJITSU LTD 发明人 HATADA AKIRA;KATAUE AKIRA;TAMURA NAOYOSHI;SHIMAMUNE YOSUKE;SHIMA MASASHI
分类号 H01L29/786;H01L21/02;H01L21/336;H01L27/12;H01L29/78 主分类号 H01L29/786
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