| 摘要 |
The present invention provides a semiconductor module having: a semiconductor device ( 10 ) having a contact device ( 11 ) for making electrical contact with a connection device ( 17; 20 ) via a rewiring device ( 15, 15', 15 ''); and a carrier device ( 12, 13, 14 ) for mechanically coupling the semiconductor device ( 10 ) to a connection device ( 17 ), the carrier device ( 12, 13, 14 ) having a gradient between a first modulus of elasticity at the semiconductor device ( 10 ) and a second, higher modulus of elasticity at the connection device ( 17; 20 ). The present invention likewise provides a method for producing a semiconductor module.
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