| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To efficiently remove impurities in a solder material increasing accompanying the operation in a flow type soldering technique. <P>SOLUTION: A solder material including impurities is stored in a treatment tank, the stored solder material is heated and melted, further, the heating-melting position is moved from the outer circumferential part of the treatment tank to the central part, impurities having a melting point lower than that of the solder material in the solder material at the part solidified once more after the completion of the heating-melting are accumulated in the central part of the treatment tank, and the solder material is discharged from the central part of the treatment tank, thus the time for removing the impurities can be reduced. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
