发明名称 |
METHOD OF FORMING FILLED ISOLATION REGION OF SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE HAVING THE FILLED ISOLATION REGION |
摘要 |
PROBLEM TO BE SOLVED: To provide an improved method of forming a filled isolation region of a semiconductor substrate, and to provide a method of forming a semiconductor device, having the filled isolation region and cooling the device and giving body potential control. SOLUTION: A semiconductor structure and a method of forming the semiconductor structure are disclosed. The semiconductor structure includes a nanostructure or is manufactured by using the nanostructure. The method of forming the semiconductor structure includes the steps of generating the nanostructure, by using a nano mask and performing an additional semiconductor processing step by using the nanostructure thus generated. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006210927(A) |
申请公布日期 |
2006.08.10 |
申请号 |
JP20060018863 |
申请日期 |
2006.01.27 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
FURUKAWA TOSHIHARU;MARK C HEIKY;STEVEN J HOLMES;DAVID V HOLLACK;KOBURGER CHARLES W III |
分类号 |
H01L21/20;H01L21/02;H01L21/336;H01L21/76;H01L21/762;H01L27/12;H01L29/423;H01L29/49;H01L29/78;H01L29/786 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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