发明名称 METHOD OF FORMING FILLED ISOLATION REGION OF SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE HAVING THE FILLED ISOLATION REGION
摘要 PROBLEM TO BE SOLVED: To provide an improved method of forming a filled isolation region of a semiconductor substrate, and to provide a method of forming a semiconductor device, having the filled isolation region and cooling the device and giving body potential control. SOLUTION: A semiconductor structure and a method of forming the semiconductor structure are disclosed. The semiconductor structure includes a nanostructure or is manufactured by using the nanostructure. The method of forming the semiconductor structure includes the steps of generating the nanostructure, by using a nano mask and performing an additional semiconductor processing step by using the nanostructure thus generated. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006210927(A) 申请公布日期 2006.08.10
申请号 JP20060018863 申请日期 2006.01.27
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 FURUKAWA TOSHIHARU;MARK C HEIKY;STEVEN J HOLMES;DAVID V HOLLACK;KOBURGER CHARLES W III
分类号 H01L21/20;H01L21/02;H01L21/336;H01L21/76;H01L21/762;H01L27/12;H01L29/423;H01L29/49;H01L29/78;H01L29/786 主分类号 H01L21/20
代理机构 代理人
主权项
地址