发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To manufacture a semiconductor device with a good property which prevents formation of fine particles by reaction of a transparent conductive film with an etching gas. SOLUTION: This invention relates to a method of manufacturing the semiconductor device, characterized by comprising the steps of: forming the transparent conductive film; forming a first conductive film on the transparent conductive film; forming a second conductive film on the first conductive film; etching the second conductive film with a gas containing chlorine; and etching the first conductive film with a gas containing fluorine. When the second conductive film is etched with the gas containing chlorine, the transparent conductive film is protected by the first conductive film. When the first conductive film is etched with the gas containing fluorine, as the transparent conductive film is not reacted with the gas containing fluorine, any particles are not formed. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006210890(A) |
申请公布日期 |
2006.08.10 |
申请号 |
JP20050364633 |
申请日期 |
2005.12.19 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
ISHIZUKA AKIHIRO;OKAMOTO SATORU;MONOE SHIGEHARU;YAMAZAKI SHUNPEI |
分类号 |
H01L21/3213;H01L21/3065;H01L21/3205;H01L21/336;H01L23/52;H01L29/786;H01L51/50;H05B33/10;H05B33/26;H05B33/28 |
主分类号 |
H01L21/3213 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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