发明名称 COVER DEVICE FOR PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a cover device for a processing apparatus having the effect superior in transmissivity, while improving strength of the cover device of the processing apparatus. SOLUTION: A transparent resin plate 10 composed of resin such as polycarbonate and a transparent glass pane 12 are joined via an adhesive resin layer 11 composed of an acrylic resin. The cover device superior in coolant resistance can be provided by minimizing an increase in the thickness of a transparent cover part 5, while largely strengthening strength of a transparent window part, by inserting punching metal 13 so as to be covered with this adhesive resin layer 11. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006205311(A) 申请公布日期 2006.08.10
申请号 JP20050021819 申请日期 2005.01.28
申请人 NIPPEI TOYAMA CORP 发明人 TATENO SHIGENOBU
分类号 B23Q11/08 主分类号 B23Q11/08
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