发明名称 Substrate holding mechanism using electrostaic chuck and method of manufacturing the same
摘要 A substrate holding apparatus includes a stage configured to support a substrate to be processed, the stage including a surface, and a continuous convex portion surrounding a predetermined region of the surface which convex portion includes a periphery surface and an upper surface that is positioned higher than the surface of the stage; an electrostatic attraction sheet configured to attract a substrate with electrostatic force, the electrostatic attraction sheet being arranged on the surface of the stage within the region surrounded by the convex portion; a first protection member configured to protect the electrostatic attraction sheet, the first protection member being arranged on the electrostatic attraction sheet and including a side surface and a portion that is arranged to face opposite the upper surface of the convex portion; an adhesive layer that is arranged at least between the electrostatic attraction sheet and the first protection member and is configured to bond the electrostatic attraction sheet and the first protection member; and a second protection member that covers at least the outer peripheral surface of the convex portion and the side surface of the first protection member to conceal at least the adhesive layer.
申请公布号 US2006175772(A1) 申请公布日期 2006.08.10
申请号 US20050549177 申请日期 2005.09.16
申请人 TOKYO ELECTRON LIMITED 发明人 NOZAWA TOSHIHISA
分类号 B32B38/00;H01L21/683 主分类号 B32B38/00
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