| 摘要 |
The present invention relates to composite processing apparatus which can securely process a conductive material, such as a copper film, at a low surface pressure and a high rate while effectively preventing the formation of pits. The composite processing apparatus of this invention including: a substrate holder ( 42 ) for holding a substrate (W); a processing table ( 46 ) including a mechanical processing section ( 82 ) for processing a surface of the substrate (W) by a processing method involving a mechanical action, and an electrolytic processing section ( 84 ), provided separately from the mechanical processing section and having a processing electrode ( 86 ) provided with an ion exchanger ( 92 ), for processing the substrate (W) by applying a voltage between the processing electrode ( 86 ) and the substrate (W) while keeping the ion exchanger ( 92 ) in contact with the substrate (W); a liquid supply section ( 94 ) for supplying a liquid between the substrate (W) and the processing electrode ( 86 ), and between the substrate (W) and the mechanical processing section ( 94 ); and a drive section for moving the substrate (W) and the processing table ( 46 ) relative to each other.
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