| 摘要 |
A process for producing a tube suitable for microfluidic devices. The process uses first and second wafers, each having a substantially uniform doping level. The first wafer has a first portion into which a channel is etched partially therethrough between second and third portions of the first wafer. The first wafer is then bonded to the second wafer so that a first portion of the second wafer overlies the first portion of the first wafer and encloses the channel to define a passage. The second wafer is then thinned so that the first portion thereof defines a thinned wall of the passage. Second and third portions of the second wafer and part of the second and third portions of the first wafer are then removed, and the thinned wall defined by the second wafer is bonded to a substrate such that the passage projects over a recess in the substrate surface. The second and third portions of the first wafer are then removed to define a tube with a freestanding portion.
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