Manufacturing structure of assembly of photoelectric semiconductor wafer involves covering large area of wafer by current conducting material and photoelectric semiconductor is then stacked on current conducting material

摘要

The method involves a wafer (10) with a given place (18) for connecting with flip-chip and a large area of the place is covered with current conducting material. A photoelectric semiconductor is stacked on the current conducting material and then photoelectric semiconductor chip (12) is packed with high molecular weight materials (14) for formation of semi-finished product. The semi-finished product is cut for formation of photoelectric structure of different dimensions or individual units.