| 摘要 |
<P>PROBLEM TO BE SOLVED: To seal bump electrodes with high precision. <P>SOLUTION: A semiconductor wafer 10 has a main surface comprising a semiconductor chip formation region 12 including many semiconductor chip regions 20a divided by scribe lines and peripheral region 14 surrounding the semiconductor chip formation region. The wafer 10 includes: circuit components formed in the semiconductor chip regions; multiple connection pads connected to the circuit component formed in the semiconductor chip regions; insulating films formed on the main surface that expose part of each connection pad; multiple bump electrodes arranged with an equal spacing of w1 and w0 formed on the insulating films in the semiconductor chip region within the multiple semiconductor chip regions and crossing over the multiple semiconductor regions, and sealing sections formed on the insulating films that expose the top plane of the multiple projection electrodes. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
