| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a solder resist on a rigid substrate, which can form a solder resist having fully high resolution, fully superior film forming properties and also having fully high thermal shock resistance. <P>SOLUTION: The photosensitive resin composition, used for forming a cured film on a rigid substrate contains (A) a modified epoxy resin having a repeating unit represented by Formula (1) [where R<SP>1</SP>denotes a divalent organic group which is a diglycidyl ether type epoxy compound residue; R<SP>2</SP>denotes a divalent organic group which is a dibasic acid residue; and R<SP>3</SP>denotes H or a group represented by Formula (2) (where R<SP>4</SP>denotes an acid anhydride residue)], (B) a photopolymerizable compound, having an ethylenically unsaturated group within a molecule and (C) a photopolymerization initiator. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
