| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress a circuit board from being deformed and a pad from being peeled by external stress applied to the circuit board. <P>SOLUTION: A plurality of pads for BGA circuit components formed in a shape of lattice on a circuit component mounting surface of a circuit board are formed rectangular, so that the area of each pad is enlarged to increase a peeling strength, and the pad is suppressed from being peeled by peeling resistance that the shape of the pad itself has. Furthermore, a corner of each of rectangular pads disposed in the shape of lattice within a rectangular area at the corner side of the pad positioned in a corner is obliquely linearly cut, so that the peeling strength is improved. Moreover, a through-hole is formed in each of the rectangular pads, so that the quantity of solders to be stuck is increased to improve the peeling strength. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
