| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card manufacturing method simplifying a manufacturing process and saving the energy and resource, to provide a probe card flexibly corresponding to decrease in pitch of terminals, diversification of the terminal arrangement, and frequent change thereof, and its manufacturing method, to provide a probe card manufacturing method forming a fine bump as a probe in a short period of time without requiring the sintering process every drop delivery, to provide a probe card allowing uniform contact by exhibiting a cushion effect to the pressure in contact with a semiconductor chip and its manufacturing method. SOLUTION: In the probe card manufacturing method, liquid material containing metal ultra-fine particles is delivered on a substrate 201 by a fine ink jet method, and the fine bump is formed. The core part 203 of the fine bump is made of silver material, and the surface section 204 is made of gold material. As the substrate, a flexible substrate is used. COPYRIGHT: (C)2006,JPO&NCIPI |
