| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling processing apparatus capable of sufficiently solving the warpage of a substrate such as a wafer when it is cooled. SOLUTION: A laser displacement gage 80 for measuring the warpage of the wafer W is provided on the cooling apparatus 40. A plurality of blowoff/suction ports capable of selectively performing blowoff and suction of a gas is formed on the surface of a cooling plate 60. On the surface of the cooling plate 60, a first blowoff/suction port 70 is formed on the position corresponding to the center of the wafer W, and a second blowoff/suction port 71 is formed on the position corresponding to the external periphery of the wafer W. An apparatus control unit 90 selects the blowoff or suction of the first blowoff/suction port 70 and the second blowoff/suction port 71 on the basis of a result of measurement of the warpage of the wafer W by the laser displacement gage 80, and keeps the wafer W to be cooled by the cooling plate 60 in a flat state by a pressure force by blowoff or a suction force. COPYRIGHT: (C)2006,JPO&NCIPI |
